|
This heating system is designed to deliver forced convection heat to the surfaces of circuit assemblies for the primary purpose of mass solder reflow attachment. Heat is carefully delivered through a ramp-soak-spike profiling method provided by twenty adjustable zones.
In operation the parts to be reflowed or thermally tested are loaded onto the conveyor in the on-load zone. The parts are then moved on the conveyor through ten vertical regions/twenty adjustable zones. After cycling, the parts are cooled, as they pass into the off-load area of the oven. The entire heat chamber is rated at a maximum temperature of 350 degrees centigrade (662 degrees F). Normal operating temperature is customarily in the 170-300C range (338 to 572 F). This is an optimum environment for forced convection heat transfer and thermal testing procedure.
SMI successfully performs critical qualifying test profiles, in a completely controlled environment, for several large manufacturers in the semiconductor sector. We provide lot tracibility with test and profile documentation to the customer, complying with their individual requirements. SMI routinely performs mass solder reflow attachment in a quicker and more efficient way, to provide our customers with uniform PCB assembly and a more manageable cost control.
|
|
|
