SURFACE MOUNT ASSEMBLY
Soldermax presents 5000 square feet of ESD controlled environment that is dedicated to Electronic Assembly. We have developed a reputation for being able to perform clean hand soldering using very fine pitch components with tremendous results. Excellent rework of surface mount devices, BGA’s and flip-chip parts is our specialty. The experienced assembly technicians at Soldermax are accurate and detailed with each project they encounter. Our automated lines will provide a quicker more efficient mass placement of fine pitch parts and components.
  • Screen Print
  • Adhesive Dispense
  • High Speed Placement
  • Fine Pitch & Flip Chip Placement
  • Reflow
  • Mixed Technology

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