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Utilizing a high powered and comprehensive AirBath system, we provide the most effective solution for high ball-count and fine pitch placement of BGA devices. Soldermax can process any type of BGA, CSP or highly sensitive device in a bench top environment. Remember, we work for the semiconductor folks that design and manufacture these devices and we are armed with the knowledge and equipment we need to do solder reflow, removal or placement of parts in a clean and efficient way. |
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